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Rieckermann provides a comprehensive portfolio of customized industrial solutions for a range of international customers, focusing on Asia and the Middle provide our expertise to various industries and specialize in process technologies – from single machines to complete production lines and turnkey facilities.

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Wafer backgrinding Wikipedia

Wafer backgrinding Wikipedia

Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and highdensity packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps. The silicon wafers predominantly used today have diameters of 200 and 300 mm.

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Equipment, Inc., was established in 1933 and has been recognized for decades as the global leader in the design, manufacturing, and service of product reliability and package testing equipment.

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